自動點膠機使用的注意事項，在使用中會出現工藝缺陷：膠點大小不合格、針頭大小、針頭與PCB板間的距離、膠水溫度、膠水的粘度、拉絲、膠水浸染焊盤、固化強度不好易掉片等。解決這些問題應整體研究各項技術工藝參數，從而找到解決問題的辦法。
Precautions for the use of automatic dispensing machine, there will be process defects in use: unqualified glue point size, needle size, distance between needle and PCB board, glue temperature, glue viscosity, wire drawing, glue dip pad, poor curing strength, easy to drop pieces, etc. To solve these problems, it is necessary to study the technical parameters as a whole, so as to find a solution.
1．點膠量的大小
1. The amount of dispensing

根據工作經驗，膠點直徑的大小應為焊盤間距的一半，貼片后膠點直徑應為膠點直徑的1.5倍。這樣就可以保證有充足的膠水來粘結元件又避免過多膠水浸染焊盤。點膠量多少由螺旋泵的旋轉時間長短來決定，實際中應根據生產情況（室溫、膠水的粘性等）選擇泵的旋轉時間。
According to the working experience, the size of the glue spot diameter should be half of the pad spacing, and the glue spot diameter after the chip is pasted should be 1.5 times of the glue spot diameter. In this way, enough glue can be used to bond the components and too much glue can be avoided to contaminate the pad. The amount of dispensing depends on the rotation time of the screw pump. In practice, the rotation time of the pump should be selected according to the production situation (room temperature, glue viscosity, etc.).
2．點膠壓力（背壓）
2. Dispensing pressure (back pressure)
目前所用點膠機采用螺旋泵供給點膠針頭膠管采取一個壓力來保證足夠膠水供給螺旋泵。背壓壓力太大易造成膠溢出、膠量過多；壓力太小則會出現點膠斷續現象，漏點，從而造成缺陷。應根據同品質的膠水、工作環境溫度來選擇壓力。環境溫度高則會使膠水粘度變小、流動性變好，這時需調低背壓就可保證膠水的供給，反之亦然。
At present, the dispensing machine adopts screw pump to supply the dispensing needle, and the rubber tube adopts a pressure to ensure enough glue to supply screw pump. If the back pressure is too high, it is easy to cause glue overflow and too much glue; if the pressure is too low, it will cause intermittent dispensing and leakage, resulting in defects. The pressure should be selected according to the same quality glue and working environment temperature. When the ambient temperature is high, the viscosity of glue will be reduced and the fluidity will be improved. At this time, the back pressure should be lowered to ensure the supply of glue, and vice versa.
3．針頭大小
3. Needle size
在工作實際中，針頭內徑大小應為點膠膠點直徑的1/2，點膠過程中，應根據PCB上焊盤大小來選取點膠針頭：如0805和1206的焊盤大小相差不大，可以選取同一種針頭，但是對于相差懸殊的焊盤就要選取不同針頭，這樣既可以保證膠點質量，又可以提高生產效率。
In the actual work, the inner diameter of the needle should be 1 / 2 of the diameter of the dispensing point. In the dispensing process, the dispensing needle should be selected according to the size of the pad on the PCB: for example, the pad sizes of 0805 and 1206 are similar, so the same kind of needle can be selected, but different needles should be selected for the pad with great difference, which can not only ensure the quality of the dispensing point, but also improve the production efficiency.
4．針頭與PCB板間的距離
4. Distance between needle and PCB
不同的點膠機采用不同的針頭，有些針頭有一定的止動度（如CAM/A LOT 5000）。每次工作開始應做針頭與PCB距離的校準，即Z軸高度校準。
Different dispensers use different needles, some of which have a certain degree of stop (such as cam / a lot 5000). The distance between the needle and PCB should be calibrated at the beginning of each work, that is z-axis height calibration.
5．膠水溫度
5. Glue temperature
一般環氧樹脂膠水應保存在0--5℃的冰箱中，使用時應提前1/2小時拿出，使膠水充分與工作溫度相符合。膠水的使用溫度應為23℃--25℃；環境溫度對膠水的粘度影響很大，溫度過低則會膠點變小，出現拉絲現象。環境溫度相差5℃，會造成50％點膠量變化。因而對于環境溫度應加以控制。同時環境的溫度也應該給予保證，濕度小膠點易變干，影響粘結力。
Generally, the epoxy resin glue should be kept in the refrigerator at 0-5 ℃, and should be taken out 1 / 2 hour in advance to make the glue fully conform to the working temperature. The use temperature of glue should be 23 ℃ -- 25 ℃; the ambient temperature has a great influence on the viscosity of glue. If the temperature is too low, the glue point will become smaller and wire drawing phenomenon will appear. The environmental temperature difference of 5 ℃ will cause the change of 50% dispensing amount. Therefore, the ambient temperature should be controlled. At the same time, the temperature of the environment should also be guaranteed, the humidity is small, the adhesive point is easy to dry, affecting the adhesion.
6．膠水的粘度
6. Viscosity of glue
膠的粘度直接影響點膠的質量。粘度大，則膠點會變小，甚至拉絲；粘度小，膠點會變大，進而可能滲染焊盤。點膠過程中，應對不同粘度的膠水，選取合理的背壓和點膠速度。
The viscosity of glue directly affects the quality of dispensing. If the viscosity is high, the adhesive point will become smaller, even wire drawing; if the viscosity is low, the adhesive point will become larger, and then the pad may be stained. In the dispensing process, the reasonable back pressure and dispensing speed should be selected for different viscosities of glue.
7．固化溫度曲線
7. Curing temperature curve
對于膠水的固化，一般生產廠家已給出溫度曲線。在實際應盡可能采用較高溫度來固化，使膠水固化后有足夠強度。
For the curing of glue, the general manufacturers have given the temperature curve. In practice, it should be cured at a higher temperature as far as possible, so that the glue has enough strength after curing.